Evaporative cooler apparatus and method

ABSTRACT

A water cooler kit is provided for use with an evaporative cooler of a type comprising at least one cooling pad, a water reservoir, a water inlet to supply water to the reservoir from a water supply at least one conduit for distributing water onto said at least one cooling pad, a fan for moving air through said cooling pad, and a pump for transferring water from said reservoir to said conduit. The water cooler kit comprises a cooling plate disposed in the reservoir, a heat dissipating structure disposed outside of the evaporative cooler, and a heat transferring thermal conductor between the cooling plate and the heat dissipating structure to transfer heat from the cooling plate to the heat dissipating structure so that heat is extracted from water in the reservoir and dissipated outside the evaporative cooler.

FIELD OF THE INVENTION

The present invention relates to evaporative coolers of the type used tocool homes and other buildings through an evaporative cooling effect.

BACKGROUND OF THE INVENTION

There are two basic types of evaporative air coolers (EAC's) used tocool homes, schools, and commercial buildings, direct and indirect. Theycan be used separately or in combination.

Evaporative coolers employ a fan or blower to draw an air stream acrosswater saturated pads or drums. The evaporating water withdraws thelatent heat of vaporization from the airstream, thus cooling air.

The fan in a direct evaporative cooler moves a supply air stream past awetted media, which adds moisture to the supply air stream to accomplishthe evaporative cooling effect. This effect uses the heat ofvaporization of the water to reduce the dry-bulb temperature.

The indirect evaporative cooler uses a heat exchanger to separate themoist evaporative cooled air (or water) from the drier room air. Themain difference in the application of these two types of evaporativecoolers is that a direct evaporative cooler uses 100% outside air forproper operation.

Each evaporative cooler typically comprises a metal, plastic orfiberglass housing and frame, a supply fan or blower, water holdingsump, water circulation pump, water distribution tubing, electricconnections and a wetted pad. These pads provide the surfaces from whichthe water evaporates, and are commonly made of aspen shavings, paper orplastic media. Evaporative coolers typically use a small fractionalhorsepower pump to raise the water and spray it over the pads, thengravity and capillary action wet the entire pad.

The efficiency of evaporative coolers depends to large extent upon thetemperature of the supplied water, with efficiency increasing as watertemperature drops. Additionally, a lower water temperature allows lowerhumidity to be maintained in the room air.

In prior art attempts to cool water in evaporative cooler reservoirs,the heat extracted from water is typically dumped back into the airstream in the evaporative cooler. This leads to the problem thatalthough the water is cooled and the cooled water is sprayed onto theevaporative pads, the heat that is removed from the water is dumped intothe cooled air moving through the evaporative cooler, therebysignificantly reducing if not eliminating any advantage provided bycooling the reservoir water.

SUMMARY OF THE INVENTION

It is one object of the present invention to provide a new and improvedevaporative cooler.

It is another object of the present invention to provide a method andapparatus to provide cooled water to an evaporative cooler.

The embodiments of the invention provide a water cooler adapted forconvenient retrofit installation to existing evaporative coolers. Theprinciples of the invention may be utilized in original equipmentevaporative coolers.

A water cooler kit is provided for use with an evaporative cooler of atype comprising at least one cooling pad, a water reservoir, a waterinlet to supply water to the reservoir from a water supply at least oneconduit for distributing water onto said at least one cooling pad, a fanfor moving air through said cooling pad, and a pump for transferringwater from said reservoir to said conduit. The water cooler kitcomprises a cooling plate disposed in the reservoir, a heat dissipatingstructure disposed outside of the evaporative cooler, and a heattransferring thermal conductor between the cooling plate and the heatdissipating structure to transfer heat from the cooling plate to theheat dissipating structure so that heat is extracted from water in thereservoir and dissipated outside the evaporative cooler.

In one embodiment, the cooling plate comprises a refrigerated coolingplate. The cooling plate may comprise a plurality of protrusions toenhance heat transfer.

In another embodiment the cooling plate comprises a thermoelectriccooling structure. The thermoelectric cooling structure may alsocomprise a plurality of protrusions to enhance heat transfer.

In various embodiments, the water cooler further comprises a cooledconduit connectable between said water supply and said water reservoirto cool water supplied to said reservoir.

In certain embodiments the cooled conduit is carried by the coolingplate. The cooled conduit may comprise a serpentine flow passage. Theserpentine flow passage may be carried on a surface of the cooling plateor within the cooling plate.

In yet further embodiments, the heat transferring thermal conductorcomprises a heat pipe.

In still further embodiments, the heat dissipating structure maycomprise one of a refrigerated plate and a thermoelectric coolingdevice. In those embodiments, the heat dissipating structure may furthercomprise the cooled conduit is carried by the cooling plate. The cooledconduit may comprise a serpentine flow passage.

The water cooler kit may further comprise at least one thermostat tocontrol operation of the temperature of the water in the reservoir andin the serpentine flow passage.

An embodiment of an evaporative cooler comprises: a frame holding atleast one cooling pad, a water reservoir, at least one conduit fordistributing water onto the at least one cooling pad, a blower formoving air through said cooling pad, a pump for transferring water fromthe reservoir to the conduit, and a water cooler. The water coolercomprises a cooling plate disposed in the reservoir; a heat dissipatingstructure disposed outside of the evaporative cooler; and a heattransferring thermal conductor between the cooling plate and the heatdissipating structure such that heat is transferred from the coolingplate to the heat dissipating structure so that heat is extracted fromthe reservoir and dissipated in the environment outside the evaporativecooler.

In various embodiments, the cooling plate comprises a refrigeratedcooling plate or a thermoelectric cooling structure. The cooling platemay comprise a plurality of protrusions.

The evaporative cooler may comprises a water inlet for supplying waterfrom a water supply to the reservoir and the water cooler may comprise acooled conduit connectable between the water supply and the waterreservoir to cool water supplied to the reservoir. In variousembodiments, the cooled conduit is carried by the cooler plate. Thecooled conduit may comprise a serpentine flow passage carried by thecooling plate. The serpentine flow passage may be carried on a surfaceof said cooling plate. The serpentine flow passage may alternatively becarried within the cooling plate.

The water cooler may comprise a thermostat to control operation of thecooling plate. The thermostatic element may be carried by the coolingplate.

The heat transfer structure of the water cooler may comprise a heatpipe.

In various embodiments, the heat dissipating structure comprises arefrigerated plate. A heat pipe may thermally couple the refrigeratedplate and the cooling plate.

Another embodiment of an evaporative cooler comprises at least onecooling pad, a water reservoir, at least one conduit for distributingwater onto the at least one cooling pad, a blower for moving air throughthe cooling pad, and a pump for transferring water from the reservoir tothe conduit. The evaporative cooler further comprises a water coolercomprising: a cooling plate disposed in the reservoir; a heatdissipating structure disposed outside of the evaporative cooler; and aheat transferring thermal conductor between the cooling plate and theheat dissipating structure such that heat is transferred from thecooling plate to the heat dissipating structure so that heat isextracted from the reservoir and dissipated outside the evaporativecooler. The evaporative cooler further comprises sequence controlapparatus to control the water cooler, pump and blower such that thewater cooler is energized to cool water in the reservoir and to energizethe pump to wet the at least one cooling pad prior to energizing theblower.

In one embodiment, the water cooler is energized prior to energizing thepump to cool water in the reservoir so that the cooling pad is wettedwith cooled water before energizing the blower.

In another embodiment, a thermostat/control apparatus is coupled to thesequence control apparatus to initiate operation of the sequence controlapparatus. The sequence control apparatus may include an interface to atelephone connection, and/or an interface to the internet or anothernetwork such as a local area network or a wide area network, and/or to awireless receiver such that operation of the evaporative coolerincluding the water cooler may be controlled remotely.

A method of operating an evaporative cooler comprises: cooling water ina water reservoir, dissipating heat extracted from the water with a heatdissipating structure located outside the evaporative cooler, andwetting an evaporative cooling medium with the cooled water.

In one embodiment the method further comprises cooling the water priorto energizing a blower to generate an air stream flowing through thewetted evaporative cooling medium.

In another embodiment the method comprises: wetting the evaporativecooling medium by pumping water from the reservoir to the evaporativecooling medium, and energizing a pump to provide water to theevaporative cooling medium subsequent to cooling the water.

In various embodiments, the method comprises controlling operation ofthe evaporative cooler remotely.

In accordance with another embodiment, apparatus is provided to controlan evaporative cooler comprising a water reservoir, a pump, anevaporative cooling medium, a fan for drawing an air steam intoengagement with the evaporative cooling medium, and a water cooler forcooling water in the reservoir. The apparatus comprises sequence controlapparatus comprising: a first output to control energizing andde-energizing the fan; a second output to control energizing andde-energizing the pump; and a third output to control energizing andde-energizing the water cooler. The sequence control apparatus isoperable to control the sequence of operation of the water cooler, thepump, and the fan.

In accordance with an embodiment, the apparatus comprises controlapparatus coupled to the sequence control apparatus to initiateoperational sequences by the sequence control apparatus. The controlapparatus may comprise one or more interfaces to receive commands fromremote locations. The commands are utilized by the control apparatus toinitiate the operational sequences. The one or more interfaces providecoupling to one or more of a wide area network, a local area network, awireless receiver, and a telephone connection.

BRIEF DESCRIPTION OF THE DRAWING

The invention will be better understood from a reading of the followingdescription in conjunction with the drawing figures in which likedesignators identify like elements and in which:

FIG. 1 illustrates a typical prior art evaporative cooler;

FIG. 2 illustrates in block diagram form an embodiment of the invention;

FIG. 3 is a block diagram;

FIG. 4 is a top view of a cooling plate;

FIG. 5 is a side view of the cooling plate of FIG. 4;

FIG. 6 is a top view of a water supply cooling plate;

FIG. 7 is a side view of an embodiment of a cooling plate construction;

FIG. 8 is a side view of a heat dissipater;

FIG. 9 is a right side view of the heat dissipater of FIG. 8;

FIG. 10 illustrates another embodiment;

FIG. 11 is a schematic view of a further embodiment;

FIG. 12 is a top view of the embodiment of FIG. 11;

FIG. 13 is a side view of the embodiment of FIG. 11;

FIG. 14 is a bottom view of the embodiment of FIG. 11;

FIG. 15 is a cross-sectional view of the embodiment of FIG. 11 takenalong lines 13-13 of FIG. 13;

FIG. 16 illustrates another embodiment; and

FIG. 17 illustrates methodology of operation of a portion of theembodiment of FIG. 16.

DETAILED DESCRIPTION

FIG. 1 illustrates, in cross section, a representative evaporativecooler 100 of a type to which the invention may be advantageouslyapplied.

Evaporative cooler 100 includes an enclosure structure or frame 101. Oneor more evaporative pads 103 are supported by structure 101.

Evaporative cooler 100 includes a water supply reservoir 105 that istypically filled with water maintained at a predetermined level by awater supply line 107 and a float valve assembly 109. A pump 111circulates water from reservoir 105 to evaporative pads 103 via a waterdistribution line 113. Water distribution line 113 may be of anyconventional design that distributes water to evaporative pads 103. Insome constructions, water distribution line 113 comprises spray heads tospread water along the entire top of evaporative pads 103. The waterflows down evaporative pads 103 to reservoir 105. As hot air is drawnthough evaporative pads 103 by a blower 115, and water evaporates frompads 103, the hot air is cooled. Blower 115 draws the cooled air intoduct 117 that distributes the cooled air into the house or otherstructure. Blower 115 receives power from electrical control 119.

It will be understood by those skilled in the art that evaporativecooler 100 is merely representative and that it is not intended to limitthe invention to the particular structure shown.

As shown in FIG. 2, one embodiment of a water cooler kit 200 inaccordance with the principles of the invention includes a cooling plate201 that is disposed within a water reservoir 105. A heat dissipatingstructure 203 is disposed outside of structure 101 of evaporative cooler100. A heat transfer thermal conductor 205 provides thermalcommunication between cooling plate 201 and heat dissipating structure203.

By separating cooling plate 201 from heat dissipating structure 203,heat that is extracted from water in reservoir 105 is removed from theconfines of evaporative cooler 100.

As noted herein above, in prior art attempts to cool water inevaporative cooler reservoirs, the heat extracted from water istypically dumped back into the air stream in the evaporative cooler.This leads to the problem that although the water is cooled and thecooled water is sprayed onto the evaporative pads, the heat that isremoved from the water is dumped into the cooled air moving through theevaporative cooler, thereby significantly reducing if not eliminatingany advantage provided by cooling the reservoir water.

The embodiment shown in FIG. 2 significantly improves upon the prior artarrangements by transferring heat extracted from water in a reservoir105 to apparatus external to evaporative cooler 100.

Water cooler kit 200 also includes a temperature sensing and controlunit or thermostat 211 that is set at a temperature such that the waterin reservoir 105 is not cooled to a low temperature such that the waterwill freeze as a result of the cooling action of kit 200. Thermostat 211typically is set to deactivate cooling when the temperature of coolingplate 201 is 40° F. or less.

When evaporative cooler 100 is operating, a substantially continuousflow of water is provided to reservoir 105 to replace evaporated water.Because tap water is used to provide the fresh water supply, the tapwater may not be cold, and may be significantly higher than thetemperature of water that returns to reservoir 105 from evaporative pads103. The result is that the temperature of water in reservoir 105 may bewarmed by the tap water.

To further assure that water delivered to evaporative pad 103 is cooledto an appropriate level, the embodiment of FIG. 3 provides pre-coolingof water supplied to evaporative cooler 100. A water supply cooler 207cools the tap water. Water supply cooler 207 is shown separate fromcooling plate 201.

It will be apparent to those skilled in the art that although watersupply cooler 207 is shown separate from cooling plate 201, water supplycooler 207 may be combined with or integrated with cooling plate 201.

Water supply cooler 207 is coupled to heat dissipating structure 203 byheat transfer thermal connector 205.

In embodiments of the invention in which water supply cooler 207 isseparate from cooling plate 201 a separate temperature control orthermostat 213 is provided. Thermostat 213 is set to prevent thetemperature of water supply cooler 207 from going below a predeterminedtemperature, e.g., 40° F., to assure that water flowing through watersupply cooler 207 does not freeze.

In embodiments of the invention in which water supply cooler 207 isintegrated with cooling plate 201, a single thermostat 211 may beutilized.

FIGS. 4 and 5 illustrate an embodiment of cooling plate 201. Coolingplate 201 comprises a material of high thermal conductivity, e.g., ametal. Cooling plate 201 includes a plurality of surface structures,protrusions, or fins 501 to enhance heat transfer from water in waterreservoir 105 to cooling plate 201. Although fins 501 are shown in FIG.5, it will be appreciated by those skilled in the art that theparticular configuration may be any configuration that enhances thermaltransfer.

Although the surface structures or fins 501 are shown on only onesurface, such surface structures or fins 501 may be present on more thanone surface of cooling plate 201. Still further the heat transferenhancing structures may be different on different surfaces of coolingplate 201.

Plate 201 also carries adjustable feet 401, 403, 405, 407 to supportcooling plate 201 in reservoir 105.

Turning now to FIG. 6, water supply cooling plate 207 is constructed ofmaterial of high thermal conductivity, e.g., metal. Water supply coolingplate 207 has a water inlet 601 and a water outlet 603. A flow passage605 couples water inlet 601 and water outlet 603. Flow passage 605follows a serpentine course to provide maximum cooling to water flowingtherein.

Flow passage 605 may be carried on one surface of water supply coolingplate 207. Alternatively, flow passage 605 may be carried within watersupply cooling plate 207. Water supply cooling plate 207 may beconstructed of multi-part construction. For example, water supplycooling plate 207 may comprise an upper plate and a lower plate with atleast one of the upper or lower plate having a flow channel formed onthe surface that mates with the other plate. The flow channel may be ofa serpentine configuration, a “U” configuration or other configurationthat enhances the heat transfer of fluid flowing therein. In aparticularly advantageous configuration, the mating surfaces of bothupper and lower plates have corresponding flow channels. The flowchannels may have surface discontinuities formed therein to furtherenhance heat transfer to cool water flowing therein.

As pointed out herein above, water supply cooling plate 207 may beintegrated with cooling plate 201 to form a unitary construction thatprovides cooling to water in reservoir 105 and to water flowing from awater supply into reservoir 105.

Turning now to FIG. 7, cooling plate 203 carries a thermoelectriccooling device 701 on its top surface. Thermoelectric cooling devices or“Peltier” devices are well known in the art and have the advantages ofbeing solid-state devices operable off of low voltage direct current. Aswith all solid state devices, thermoelectric cooling devices are highlyreliable and have long operational lives.

Thermoelectric cooling device 701 has its cooling surface 703 in thermalengagement with cooling plate 201 and its hot surface 705 in thermalengagement with heat transfer thermal conductor 205.

Heat transfer thermal conductor 205 may be a flexible thermal conductor,a heat pipe, or any other type of structure that efficiently transfersthermal energy from surface 705 to heat dissipater 203.

Heat dissipater 203 may be a finned thermal dissipater of a type wellknown in the art.

Turning now to FIGS. 8 and 9, an embodiment of heat dissipater 203 isshown. Heat dissipater 203 comprises a thermoelectric cooling device801. Thermoelectric cooling device 801 has a cooling surface 803 and ahot surface 805 when powered from an electric power source 831 that isnot shown. A power controller 833 is disposed between power source 831and thermoelectric cooling device 801. Power controller is coupled tothermostat 211 to thereby control operation of thermoelectric coolingdevice 801.

Cooling surface 803 is in thermal engagement with heat transfer thermalconductor 205 to provide cooling to 201.

In embodiments in which a water supply cooling plate 207 is provided,cooling surface 803 also provides cooling to water supply cooling plate201 and an additional thermostat 213 is also couple to power controller833.

Hot surface 805 is in thermal engagement with a heat dissipatingstructure 807. In the embodiment shown, heat dissipating structure 807comprises a surface structure to dissipate heat into the ambient air. Asshown in FIG. 9, the surface structure comprises a plurality heatdissipating fins 809.

Turning now to FIG. 10, a particularly advantageous further embodimentof the invention is shown. In this embodiment, a thermoelectric coolingdevice is uses in accordance with the embodiment shown in FIG. 7 or FIG.8.

Because thermoelectric cooling devices utilize low voltage directcurrent, advantageous use may be made of photovoltaic solar panels 1001.Photovoltaic solar panels can be configured to provide the low voltagedirect current directly to thermoelectric cooling devices. Utilizingsolar panels as part of the power source for thermoelectric coolingdevices can further reduce the operating cost of cooling evaporativecooler water.

Power controller 831 may also provide control of battery backup andenergy storage for solar panel 1001 and it may also provide forautomatic switching to commercial alternating current power.

In a further embodiment, a refrigeration circuit is utilized rather thana thermoelectric module. FIG. 11 illustrates a schematic diagram of arefrigeration circuit 1100 that may be advantageously utilized.Refrigeration circuit 1100 is divided into a first portion 1101 and asecond portion 1103.

First portion 1101 comprises a compressor 1105 having a suction line1107 and a discharge line 1109. A condenser 1111 is provided indischarge line 1109 for condensing the compressed refrigerant vaporcoming from the compressor 1105. An expansion valve 1113 is provided forflashing a portion of pressurized liquid refrigerant into a vaporthereby lowering the temperature and pressure of the remainingun-vaporized refrigerant.

Second portion 1103 of refrigeration circuit 1100 comprises anevaporator assembly 1115 connected between discharge line 1109 andsuction line 1107.

Gaseous refrigerant is compressed, condensed to a liquid and thenexpanded, in the form of a liquid spray into evaporator assembly 1115.Heat transferred into the liquid refrigerant causes it to evaporate. Theevaporated refrigerant passes through suction line 1107 back tocompressor 1105.

Evaporator assembly 1115 is an aluminum roll-bond evaporator plate 1117of a type commercially available. Evaporator plate 1117 comprises a flatsheet of aluminum containing an integral serpentine refrigerant passage1119. It will be appreciated by those skilled in the art that othermaterials could also be used to construct the evaporator plate 1117 suchas aluminum alloys, copper or other suitably conductive metals.

Commercially available roll-bond evaporator plate 1117 is of a typefabricated by rolling together two sheets of aluminum, applying heat andpressure during the rolling process such that the two sheets areeffectively welded together into a single sheet. By applying a specialcoating (sometimes referred to as “weld stop”) between the sheets priorto the rolling/welding operation, it is possible to prevent the twosheets from welding together in the areas where the coating is applied.Thus by applying the coating in a serpentine pattern, it is possible tocreate a serpentine-shaped unwelded region within this welded part. Bysubsequently applying hydraulic pressure to this unwelded region, it ispossible to inflate the unwelded serpentine region to form a serpentinepassage through the plate. Thus a plate with an integral serpentinepassage can be created in a very cost-effective manner. This type ofevaporator is commonly used in domestic refrigerator applications wherelow cost is of extreme importance.

Except for the serpentine refrigerant passage 1119, evaporator plate1117 is primarily flat. Evaporator plate 1117 is coupled to condenser1111 and suction line 1107.

A power control circuit 1131 controls application of power to compressor1105. Power control circuit 1105 is coupled to thermostat 211 to controlthe temperature of cooling plate 201.

Turning to FIGS. 12 through 15, heat dissipating structure 203 comprisesa cold roll-bond evaporator plate 1117 in thermal engagement with heattransfer thermal connector 205. Heat dissipating structure 203 iscarried in insulating support structure 1205.

Support structure 1205 also carries compressor 1105 disposed in a box1215. It will be appreciated by those skilled in the art that compressor1105 may be positioned at other locations proximate evaporator plate1117.

Condenser 1111 is carried below box 1215. It will be appreciated bythose skilled in the art that condenser 1111 may disposed at otherlocations proximate cold roll-bond evaporator plate 1117.

In operation, refrigeration circuit 1100 cools evaporator plate 1117which in turn is thermally coupled to cooling plate 201 via heattransfer thermal connector 205. The result is that heat is transferredfrom cooling plate 201 to evaporator plate 1117, which in turn transfersthe heat to condenser 1111.

A particularly advantageous embodiment of the invention is shown in FIG.16. Evaporative cooler 100 includes an enclosure structure or frame 101.One or more evaporative pads 103 are supported by structure 101.

Evaporative cooler 100 includes a water supply reservoir 105 that istypically filled with water maintained at a predetermined level by awater supply line 107 and a float valve assembly 109. A pump 111circulates water from reservoir 105 to evaporative pads 103 via a waterdistribution line 113. Water distribution line 113 may be of anyconventional design that distributes water to evaporative pads 103. Insome constructions, water distribution line 113 comprises spray heads tospread water along the entire top of evaporative pads 103. The waterflows down evaporative pads 103 to reservoir 105. As hot air is drawnthough evaporative pads 103 by a blower 115, and water evaporates frompads 103, the hot air is cooled. Blower 115 draws the cooled air intoduct 117 that distributes the cooled air into the house or otherstructure. Blower 115 comprises a motor M. Electrical power is sourcedto motor M from electrical source 119.

It will be understood by those skilled in the art that evaporativecooler 100 is merely representative and that it is not intended to limitthe invention to the particular structure shown.

Water cooler 200 includes a cooling plate 201 disposed within waterreservoir 105. Heat dissipating structure 203 is disposed outsidestructure 101 of evaporative cooler 100. A heat transfer thermalconductor 205 provides thermal communication between cooling plate 201and heat dissipating structure 203. Power control circuit 831, whenenergized operates as described hereinabove.

As described hereinabove, by separating cooling plate 201 from heatdissipating structure 203, heat that is extracted from water inreservoir 105 is removed from the confines of evaporative cooler 100.

The embodiment shown in FIG. 16 advantageously includes controlapparatus comprising a thermostat/control 1601, a sequence control 1603and timer 1605 and power control circuit 831. Power control circuit 831is described hereinabove. Thermostat/control 1601 may be used to turnevaporative cooler 100 on or off, and may also include a temperaturecontrol or thermostat that is utilized to maintain a constantpredetermined temperature. Thermostat/control 1601 is mounted within thestructure to be cooled and may include an integral temperature sensor,however, in certain embodiments, the temperature sensor 1607 may belocated separate from the thermostat/control 1601.

Thermostat/control 1601 is coupled to sequence control apparatus 1603.Sequence control apparatus 1603 is coupled to a power control circuit831, blower motor M, and pump 111. A timer circuit 1605 is coupled tosequence control apparatus 1603 and is utilized by sequence controlapparatus 1603 to generate timed control signals. Sequence control 1603may comprise a microcontroller in various embodiments.

Turning now to FIG. 17 the operation of thermostat/control 1601 andsequence control apparatus 1603 is shown.

At step 1701, a call for cooling is provided to sequence controlapparatus 1603. The call for cooling output may be generated when athermostat determines that the temperature is above a preselected leveland/or an evaporative cooler cooling switch is switched to “cooling on”.In addition, the call for cooling output may be provided from a remotelocation via an interface 1605 that provides for remote control of thesequence control apparatus. Interface 1605 may be coupled to a wired orwireless telephone 1611, or to an Internet interface 1613, or to awireless receiver 1615, or may be coupled via various known means toother control sources. Sequence control apparatus 1603 starts coolingthe water in reservoir 105 at step 1703 by energizing water chiller 200before causing blower motor M to be energized. In one embodiment,sequence control apparatus 1603 is programmed such that after the waterin reservoir 105 reaches a predetermined temperature, or after apredetermined time period, sequence control 1603 turns pump 111 on atstep 1705 to wet cooler pads 103. By turning pump 111 on, theevaporative cooler pads 103 are wetted with pre-chilled water.

Sequence control apparatus 1603 may alternatively be programmed suchthat both water chiller 200 and pump 111 are energized at the same timeto both wet pads 103 and to cool water supplied to the pads 103. After asecond predetermined time period, blower motor M is energized at step1707. The second predetermined time period may be set or adjusted insequence control apparatus 1603.

When temperature sensor 1607 indicates that a preset temperature isreached at step 1709, sequence control apparatus 1603 de-energizesblower motor M at step 1711, de-energizes pump 111 at step 1713 andturns of water cooler 200 at step 1715.

Sequence control apparatus 1603 may be programmed such that blower motorM is turned off, but pump 111 and water cooler 200 remain energized,such that cool water is continuously used to wet pads 103 as long asevaporative cooler 100 is activated.

Sequence control apparatus 1603 may be programmed such that when blowermotor M is de-energized, pump 111 is also de-energized but water cooler200 remains energized, or remains energized for a predetermined timeperiod such that water in reservoir 115 remains cooled.

The invention has been described in terms of various embodiments. Itwill be apparent to those skilled in the art that various changes andmodifications may be made to the embodiments shown and described withoutdeparting from the spirit or scope of the invention. It is intended thatthe embodiments shown and described are illustrative of the principlesof the invention and that the invention not be limited to suchembodiments. It is intended that the invention be limited in scope onlyby the claims appended hereto.

1. A water cooler kit for use with an evaporative cooler comprising aframe holding at least one cooling pad, a water reservoir, at least oneconduit for distributing water onto said at least one cooling pad, a fanfor moving air through said cooling pad, and a pump for transferringwater from said reservoir to said conduit, said water cooler kitcomprising: a refrigerated cooling plate disposed in said reservoir tocool water in said reservoir below the temperature of ambient airoutside said evaporative cooler; a heat dissipating structure disposedoutside of said evaporative cooler; and a heat transferring thermalconductor between said refrigerated cooling plate and said heatdissipating structure to transfer heat from said refrigerated coolingplate to said heat dissipating structure so that heat is extracted fromsaid reservoir and dissipated outside said evaporative cooler.
 2. Awater cooler kit in accordance with claim 1, wherein: said refrigeratedcooling plate comprises an evaporator.
 3. A water cooler kit inaccordance with claim 1, wherein: said refrigerated cooling platecomprises a thermoelectric cooling structure.
 4. A water cooler kit inaccordance with claim 1, wherein: said refrigerated cooling platecomprises a plurality of protrusions.
 5. A water cooler kit inaccordance with claim 4, wherein: said refrigerated cooling platecomprises an evaporator.
 6. A water cooler kit in accordance with claim4, wherein: said refrigerated cooling plate comprises a thermoelectriccooling structure.
 7. A water cooler kit in accordance with claim 1,wherein: said evaporative cooler comprises a water inlet for supplyingwater from a water supply to said reservoir and said kit comprises: acooled conduit connectable between said water supply and said waterreservoir to cool water supplied to said reservoir.
 8. A water coolerkit in accordance with claim 7, wherein: said cooled conduit is carriedby said refrigerated cooling plate.
 9. A water cooler kit in accordancewith claim 8, wherein: said cooled conduit comprises a serpentine flowpassage carried by said refrigerated cooling plate.
 10. A water coolerkit in accordance with claim 9, wherein: said refrigerated cooling platecomprises an evaporator.
 11. A water cooler kit in accordance with claim1, wherein: said refrigerated cooling plate comprises a thermoelectriccooling structure.
 12. A water cooler kit in accordance with claim 9,wherein: said serpentine flow passage is carried on a surface of saidrefrigerated cooling plate.
 13. A water cooler kit in accordance withclaim 9, wherein: said serpentine flow passage is carried within saidrefrigerated cooling plate.
 14. A water cooler kit in accordance withclaim 1, comprising: a thermostat to control operation of saidrefrigerated cooling plate.
 15. A water cooler kit in accordance withclaim 1, comprising: a thermostatic element carried by said coolingplate to control operation of said refrigerated cooling plate.
 16. Awater cooler kit in accordance with claim 1, comprising: adjustablesupports carried by said refrigerated cooling plate for adjusting theposition of said cooling plate in said reservoir.
 17. A water cooler kitin accordance with claim 1, wherein: said heat transferring thermalconductor comprises a heat pipe.
 18. A water cooler kit in accordancewith claim 1, wherein: said heat dissipating structure comprises arefrigerated plate in thermal communication with said refrigeratedcooling plate.
 19. A water cooler kit in accordance with claim 18,comprising: a heat pipe thermally coupling said refrigerated plate andsaid refrigerated cooling plate.
 20. A water cooler kit in accordancewith claim 1, wherein: said heat dissipating structure comprises athermoelectric cooling device in thermal communication with saidrefrigerated cooling plate.
 21. A water cooler kit in accordance withclaim 20, comprising: a heat pipe thermally coupling said thermoelectriccooling device and said refrigerated cooling plate.
 22. An evaporativecooler comprising: an evaporative cooling medium; a water reservoir; atleast one conduit for distributing water onto said evaporative coolingmedium; a fan for moving air through said cooling medium; a pump fortransferring water from said reservoir to said conduit; a water coolercomprising: a refrigerated cooling plate disposed in said reservoir tocool water in said reservoir to a temperature below the temperature ofsaid air; a heat dissipating structure disposed outside of saidevaporative cooler; and a heat transferring thermal conductor betweensaid refrigerated cooling plate and said heat dissipating structure suchthat heat is transferred from said cooling plate to said heatdissipating structure so that heat is extracted from said reservoir anddissipated outside said evaporative cooler.
 23. An evaporative cooler inaccordance with claim 22, comprising: control apparatus operable toprovide sequenced operation of said water cooler, said pump and saidfan.
 24. An evaporative cooler in accordance with claim 22, comprising:control apparatus operable to provide for remote control of saidevaporative cooler.
 25. A method of operating an evaporative coolercomprising a water reservoir, a pump, a fan, and an evaporative coolingmedium, said method comprising: cooling water in said water reservoirwith a refrigerated cooling plate to a temperature below the temperatureof ambient air outside said evaporative cooler; dissipating beatextracted from said water by said refrigerated cooling plate with a heatdissipating structure located outside the evaporative cooler; andwetting said evaporative cooling medium with the cooled water.
 26. Amethod in accordance with claim 25, comprising: energizing said fan togenerate an air stream flowing through the wetted evaporative coolingmedium; and performing said cooling water step prior to said energizingstep.
 27. A method in accordance with claim 25, comprising: pumpingwater from the reservoir to said evaporative cooling medium to wet saidevaporative cooling medium; and performing said pumping step subsequentto cooling said water.
 28. A method in accordance with claim 25,comprising: controlling operation of said evaporative cooler remotely.29. Apparatus for controlling an evaporative cooler comprising a waterreservoir, a pump, an evaporative cooling medium, a fan for drawing anair steam into engagement with said evaporative cooling medium, and awater cooler for cooling water in said reservoir, said apparatuscomprising: sequence control apparatus, said sequence control apparatuscomprising: a first output to control energizing and de-energizing saidfan; a second output to control energizing and de-energizing said pump;and a third output to control energizing and de-energizing said watercooler; said sequence control apparatus operable to control the sequenceof operation of said water cooler, said pump and said fan.
 30. Apparatusin accordance with claim 29, comprising: control apparatus coupled tosaid sequence control apparatus to initiate operational sequences bysaid sequence control apparatus.
 31. Apparatus in accordance with claim30, wherein: said control apparatus comprises one or more interfaces toreceive commands from remote locations, said commands utilized by saidcontrol apparatus to initiate said operational sequences.
 32. Apparatusin accordance with claim 31, wherein: said one or more interfacesprovide coupling to one or more of a wide area network, a local areanetwork, a wireless receiver, a telephone connection.
 33. A water coolerkit for use with an evaporative cooler comprising a frame holding atleast one cooling pad, a water reservoir, at least one conduit fordistributing water onto said at least one cooling pad, a fan for movingair through said cooling pad, and a pump for transferring water fromsaid reservoir to said conduit, said water cooler kit comprising: arefrigerated cooling plate disposed in said evaporative cooler to coolwater in said reservoir below the temperature of ambient air outsidesaid evaporative cooler, said refrigerated cooling plate comprising oneof a thermoelectric device, an evaporator plate, a cooling platethermally coupled to a cooling portion of a thermoelectric device, and acooling plate thermally coupled to an evaporator; a heat dissipatingstructure disposed outside of said evaporative cooler; and a heattransferring thermal conductor between said refrigerated cooling plateand said heat dissipating structure to transfer heat from saidrefrigerated cooling plate to said heat dissipating structure to extractheat from said reservoir and dissipated outside said evaporative cooler.34. A water cooler kit in accordance with claim 33, comprising: saidheat dissipating structure comprises one of heat dissipating fins; heatdissipating fins with a fan; a thermoelectric device, a refrigerationcondenser, and an evaporator and condenser.
 35. A water cooler kit inaccordance with claim 34, wherein: said evaporative cooler comprises awater inlet for supplying water from a water supply to said reservoirand said kit comprises: a refrigerated conduit connectable between saidwater supply and said water reservoir to cool water supplied to saidreservoir.
 36. A water cooler kit in accordance with claim 35,comprising: said refrigerated conduit is thermally coupled to one of athermoelectric device, an evaporator plate, a cooling plate thermallycoupled to a cooling portion of a thermoelectric device, and a coolingplate thermally coupled to an evaporator.
 37. A water cooler kit inaccordance with claim 35, wherein: said refrigerated conduit comprises aserpentine passage for water to flow to said reservoir.